SGM8103J, YEESTOR’s automotive-grade eMMC 5.1 device, employs pMLC (pseudo-MLC) flash in 32 GB / 64 GB / 128 GB options within an 11.5 mm × 13.0 mm × 1.0 mm BGA153 package. Qualified to AEC-Q100 Grade 1, it operates from –40 °C to +105 °C. HS400 mode delivers 330 MB/s sequential read and 260 MB/s write, with 30 k / 18 k 4 kB random IOPS. On-chip 3rd-generation LDPC ECC, dynamic wear-leveling, bad-block management and power-loss protection (PLP) keep the bit-error rate below 10⁻¹⁵. Standby current is <150 µA and deep-sleep <40 µA. The device has passed 3 000 P/E cycles, 1 000 h high-temperature aging and 50 G vibration tests, making it ideal for demanding applications such as in-vehicle infotainment, ADAS, advanced T-Boxes and high-temperature industrial control systems.
YEESTOR boasts extraordinary strength in terms of technology. It is the only enterprise in Chinese mainland that has the ability to independently develop automotive-grade eMMC main control chips and has achieved mass production. After 18 years of technical accumulation and business expansion, the company has built a complete product line of storage control chips, covering everything from solid-state drive storage to embedded storage and expandable storage, and comprehensively covering application scenarios such as consumer-grade, industrial-grade, automotive-grade and enterprise-grade. Its technical strength is also reflected in mastering a number of key technologies in the industry. At present, it has obtained more than 300 authorized invention patents, demonstrating profound technical heritage. As an agent, Mandu Technology provides customers with a variety of storage solutions.
--MLC eMMC--
Part Number | Flash Type | Density | Pkg. | Voltage | Temp | Download |
SGM8000I | MLC | 8GB ~ 64GB | BGA153 Ball | 11.5×13.0×1.0 | -40°C ~ +85°C | Not yet |
SGM8000K | MLC | 8GB ~ 64GB | BGA153 Ball | 11.5×13.0×1.0 | -40°C ~ +85°C | Not yet |
SGM8000J | MLC | 8GB ~ 64GB | BGA153 Ball | 11.5×13.0×1.0 | -40°C ~ +105°C | Not yet |
SGM8000H | MLC | 8GB ~ 64GB | BGA153 Ball | 11.5×13.0×1.0 | -25°C ~ +85°C | Not yet |
--pMLC eMMC--
Part Number | Flash Type | Density | Pkg. | Voltage | Temp | Download |
SGM8103I | pMLC | 32GB ~ 128GB | BGA153 Ball | 11.5×13.0×1.0 | -40°C ~ +85°C | Not yet |
SGM8103K | pMLC | 32GB ~ 128GB | BGA153 Ball | 11.5×13.0×1.0 | -40°C ~ +85°C | Not yet |
SGM8103J | pMLC | 32GB ~ 128GB | BGA153 Ball | 11.5×13.0×1.0 | -40°C ~ +105°C | Not yet |
SGM8203J | pMLC | 32GB ~ 64GB | BGA153 Ball | 11.5×13.0×1.0 | -40°C ~ +105°C | Not yet |
--pSLC eMMC--
Part Number | Flash Type | Density | Pkg. | Voltage | Temp | Download |
SGM8005I | pSLC | 4GB ~ 32GB | BGA153 / BGA100 Ball | 11.5×13.0×1.0 / 14.0×18.0×1.4 | -40°C ~ +85°C | Not yet |
SGM8105I | pSLC | 8GB ~ 64GB | BGA153 Ball | 11.5×13.0×1.0 | -40°C ~ +85°C | Not yet |
SGM8005J | pSLC | 8GB ~ 32GB | BGA153 Ball | 11.5×13.0×1.0 | -40°C ~ +105°C | Not yet |
SGM8005H | pSLC | 4GB ~ 32GB | BGA153 / BGA100 Ball | 11.5×13.0×1.0 / 14.0×18.0×1.4 | -25°C ~ +85°C | Not yet |
Telephone: +86-150-1290-5940
Mobile phone: +86-150-1290-5940
Mailbox: sales@manduic.com
Address: B1205, building 2, Fenghui garden, No. 9, South Ring Road, Matian street, Guangming District, Shenzhen