In the NAND Flash field, Winbond Electronics focuses on small and medium capacity SLC NAND Flash, particularly in the 1Gb and 2Gb capacity range, to meet high bandwidth and low power consumption applications. Winbond's products are known for their low power consumption, high storage density, high reliability, and easy integration, featuring standardized serial interfaces for easy integration into embedded systems. In terms of technological innovation, Winbond continues to upgrade its process technology from 46nm to 1x nm and adopts 3D NAND structures to increase density. Its QspiNAND Flash series supports high capacity and high data transfer rates, while the world's first OctalNAND Flash provides high-performance, cost-effective storage solutions for automotive, communications, and industrial systems. Additionally, Winbond's secure flash memory technology can self-detect data integrity to ensure data security. In consumer electronics, automotive electronics, and IoT fields, Winbond has won widespread market recognition and demonstrated strong competitiveness through continuous technological innovation and product upgrades.
Among them, the W29N04GWBJBA is a 4Gb NAND Flash chip launched by Winbond, packaged in VFBGA-63, with a working voltage of 1.8V, suitable for industrial applications. It features a wide operating temperature range of -40°C to 85°C, supports fast random read (approximately 25 microseconds), page program (approximately 250 microseconds), and block erase (approximately 2 milliseconds). The large capacity, high performance, and high reliability of the W29N04GWBJBA make it popular in consumer electronics, industrial control, and automotive electronics, making it an ideal choice for data storage and transfer.
In industrial applications, the W29N04GWBJBA performs well, supporting fast random read, page program, and block erase to ensure efficient data transfer and storage. Moreover, the chip's high reliability and durability enable it to maintain stable performance during long-term, high-load operation, making it suitable for industrial control, security monitoring, and data acquisition scenarios. Winbond's advanced packaging design and manufacturing processes provide strong assurance for the stability of the W29N04GWBJBA in complex industrial environments. After rigorous testing and validation, the product demonstrates strong adaptability and can effectively meet the various challenges in industrial settings, ensuring reliable storage solutions for customers.
About Mandu Technology
Shenzhen Mandu Technology Co., Ltd. has steadfastly centered its operations on the distribution of high-performance, high-quality, and highly reliable integrated circuit products. Its portfolio encompasses memory chips, differential crystal oscillators, and MCU microcontrollers, while progressively integrating analog signal chain products. The company prides itself on delivering comprehensive and cost-effective solutions to its customers. Its products find applications across a broad spectrum of industries, including but not limited to network communication, industrial control, robotics, medical equipment, personal health, and numerous other fields.
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Website: www.manduic.com
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Telephone: +86-150-1290-5940
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