XM25QU128C seamlessly replaces W25Q128, adapting to IoT module applications

With the explosive growth of Internet of Things (IoT) endpoints, wireless modules—including Wi-Fi, BLE, and NB-IoT—serve as the core networking components. The storage solutions within these devices face stringent requirements. Among various brands, Serial NOR Flash has become the predominant choice for firmware storage in most communication modules due to its support for eXecute-In-Place (XIP) mode, low-latency read access, and high reliability. However, the limitations of traditional NOR Flash chips in power consumption, program/erase endurance, and interface speed are becoming bottlenecks that constrain the intelligent upgrade of terminal devices.

Wuhan Xinxin's XM25QU128CHIQT08Q, a 128Mbit high-capacity NOR Flash memory chip, serves as a fully compatible replacement for Winbond's W25Q128JVSIQ.

The demands of IoT modules on NOR Flash differ from those of consumer devices like smartphones or PCs. Devices require high endurance for frequent Over-The-Air (OTA) updates, typically exceeding 100,000 cycles. A vast number of battery-powered devices, such as sensors and wearables, are extremely sensitive to power consumption, making standby current a critical selection criterion. Furthermore, to achieve rapid network connectivity, modules must load communication protocol stacks immediately upon power-up, necessitating high read speeds from the NOR Flash to avoid connection delays. The memory chip must also meet design requirements for small form factors, high integration, and pin compatibility. In contrast, some traditional NOR Flash solutions, constrained by support for only low-speed SPI interfaces, endurance below 50,000 cycles, and relatively high standby power, are increasingly unable to meet the comprehensive performance demands of next-generation IoT modules.

Key Parameters of XM25QU128CHIQT08Q 

1. High-Speed Interface Support, Enhancing System Responsiveness 

l Supports Quad SPI and XPI (eXtended Performance Interface) modes, with a read bandwidth of up to 133 MHz. It is compatible with XIP functionality, allowing the MCU to execute code directly from the Flash, eliminating the need for SRAM buffering and reducing startup time.

l Tests show that loading a lightweight RTOS and protocol stack in a Wi-Fi module can achieve a cold start time under 200ms, outperforming some competitors limited to Dual SPI.

l Note: XPI is not a universal industry standard; confirmation of support from the host MCU (e.g., ESP32, nRF52840) is required. 

2. Endurance and Data Retention

l Rated for over 100,000 program/erase cycles and a data retention period exceeding 20 years.

l Compared to Winbond's W25Q128JVSIQ (also rated for 100k cycles), both are comparable in endurance metrics.

l Built-in ECC mechanism can automatically correct minor bit errors, enhancing long-term operational reliability.

3. Low-Power Design for Battery-Powered Scenarios 

l Typical standby current is below 10 µA, with an active read current of approximately 12 mA.

l Supports a deep power-down mode, which can further reduce current to below 1 µA, making it ideal for intermittently waking devices like temperature and humidity sensors.

4. Package and Compatibility 

l Utilizes an 8-pin SOIC (208mil) package, offering physical pin-to-pin compatibility with the W25Q128JVSIQ.

l Operating voltage range: 2.7V to 3.6V.

l Provides an OTP (One-Time Programmable) area for storing unique device IDs or security keys, enhancing firmware tamper resistance.

Comparison: XM25QU128CHIQT08Q vs. W25Q128JVSIQ

In terms of performance parameters, the two chips are highly comparable. The primary advantages of the XM25QU128CHIQT08Q lie in guaranteed domestic supply chain security and faster local technical support response.

The XM25QU128CHIQT08Q is highly compatible with the Winbond W25Q128JVSIQ, achieving seamless replacement across key dimensions such as capacity, pinout, electrical characteristics, and command set. This feature significantly lowers the barrier to adoption for module manufacturers—enabling a quick switch to a domestic component without the need for hardware redesign or major firmware driver adjustments.

About Mandu Technology

Shenzhen Mandu Technology Co., Ltd. has steadfastly centered its operations on the distribution of high-performance, high-quality, and highly reliable integrated circuit products. Its portfolio encompasses memory chips, differential crystal oscillators, and MCU microcontrollers, while progressively integrating analog signal chain products. The company prides itself on delivering comprehensive and cost-effective solutions to its customers. Its products find applications across a broad spectrum of industries, including but not limited to network communication, industrial control, robotics, medical equipment, personal health, and numerous other fields.

Business: sales@manduic.com