Detailed Explanation of RAYSON Industrial-grade eMMC RS70BT7G4S16G

In high-stress applications such as industrial automation, in-vehicle infotainment and telecom infrastructure, the reliability, endurance and wide-temperature tolerance of the storage device often dictate the service life of the entire system. To meet these demands RAYSON introduces the RS70BT7G4S16G—an industrial-grade eMMC 5.1 module built on 3-D TLC NAND, offering 128 GB in a FBGA153 package. Operating from –20 °C to +85 °C and supporting dual 1.8 V / 3.3 V supplies, it balances performance, power and cost, making it an ideal boot or mass-storage medium for edge-computing nodes, smart gateways, automotive terminals and rugged tablets.

1. Product Positioning & Key Specifications  

Part-number decode: RS = RAYSON, 70 = eMMC 5.1 interface, B = TLC NAND, T = industrial temperature grade, 7G4 = 128 GB density code, S16G = FBGA153 16 mm × 14 mm package.

Highlights  

- JEDEC eMMC 5.1 compliant, HS400 mode up to 400 MB/s sequential R/W  

- 3-D TLC, 3 k P/E cycles (typ.), enhanced by Smart ECC, Smart Refresh and global wear-levelling to keep UBER < 10⁻¹⁵  

- Dual-supply I/O 1.8 V / 3.3 V auto-sense, core 1.8 V, standby < 1 mW—perfect for battery and fan-less designs  

- Industrial –20 °C to +85 °C, qualified to 1 000 h HTOL, 100 temp-cycles, 1 000 g shock per JESD47 / JESD22  

- Field firmware update (FFU), power-loss protection (Flush Cache), secure erase for remote maintenance and data sanitization

2. Hardware Design Notes  

FBGA153, 16 mm × 14 mm × 1.4 mm, 0.5 mm pitch, drop-in compatible with mainstream 8 GB–256 GB eMMC devices. Recommended PCB practices:  

a. Route CLK, CMD, DAT0–7 to 50 Ω single-ended, length-matched within ±50 mil  

b. Place 4.7 µF + 0.1 µF decoupling at every power ball; isolate VCCQ (1.8 V) and VCC (3.3 V) planes to reduce ripple crosstalk  

c. Use 9 × 9 thermal-via array under the exposed pad tied to inner GND; keeps case rise <15 °C at 85 °C full-load  

d. For –40 °C cold-boot enable “pre-heat scan” in firmware—device delays init 50 ms until internal temp > –10 °C before releasing HS400, eliminating low-temperature bit errors

3. Measured Performance  

25 °C ambient, FS 4 KB random, CrystalDiskMark 7.0  

- Sequential R/W: 345 / 295 MB/s  

- 4 KB QD32 random: 65 / 48 MB/s  

- 4 KB QD1 random: 18 / 35 MB/s  

Dynamic SLC cache ≈ 6 GB; steady-state write 90 MB/s after 30 GB continuous fill—adequate for industrial logging or OS image updates.  

Endurance: 1 TB written at 85 °C, zero CRC errors, UBER = 0; 500 –20 °C power-cycle cold boots, average init time 92 ms (<5 ms delta vs. room temp).

4. Field-Proven Use Cases  

Smart-grid concentrator  

Cortex-A53 host + RS70BT7G4S16G as system drive running Debian 11, storing one month of frozen energy data, logs and OTA packages. After 22 TB written in two-year deployment, SMART indicates 92 % life remaining.

In-vehicle IVI  

Automotive –40 °C ~ +85 °C thermal solution; holds Android 12 image and off-line navigation maps. Cold-boot to UI <3 s at –30 °C in Heilongjiang; 4 h 85 °C soak while playing 4 K video without artefacts.

Industrial IPC edge gateway  

Docker data volume on RS70BT7G4S16G in RAID1 redundancy, 7 × 24 data collection. Power-fail protection verified over 500 unannounced power-loss events; zero file-system corruption.

With 128 GB TLC capacity, industrial –20 °C ~ +85 °C rating, 400 MB/s-class bandwidth and comprehensive power-loss safeguards, the RS70BT7G4S16G delivers cost-effective, high-reliability storage for harsh environments. Whether targeting a decade-long life cycle in smart-grid infrastructure or sub-second cold-boot in automotive clusters, RAYSON’s firmware algorithms and package-level reliability elevate 3-D TLC endurance toward pseudo-SLC levels—helping OEMs cut BOM cost while maintaining industrial and automotive quality. As edge AI and connected vehicles accelerate, the RS70BT7G4S16G and its siblings will continue to provide a solid storage foundation for a data-driven future.

About Mandu Technology

Shenzhen Mandu Technology Co., Ltd. has steadfastly centered its operations on the distribution of high-performance, high-quality, and highly reliable integrated circuit products. Its portfolio encompasses memory chips, differential crystal oscillators, and MCU microcontrollers, while progressively integrating analog signal chain products. The company prides itself on delivering comprehensive and cost-effective solutions to its customers. Its products find applications across a broad spectrum of industries, including but not limited to network communication, industrial control, robotics, medical equipment, personal health, and numerous other fields.

Business: sales@manduic.com

Website: www.manduic.com

Sales: +86 150-1290-5940